Copper core balls ua lub luag haujlwm tseem ceeb hauv kev ntim khoom 3D, tswj cov qauv kev ruaj ntseg, txhim kho electrothermal kev ua tau zoo, thiab ua kom muaj kev ntseeg siab ntawm kev sib tshuam. Especially in HBM memory and AI chips, they are a core supporting technology for achieving high-density stacking and high-performance computing.
Nrog rau qhov kev nrhiav siab heev ntawm kev suav lub zog thiab cov ntaub ntawv hloov pauv hauv AI chips thiab siab -bandwidth nco (HBM), cov khoom siv ib txwm muaj lub ntsej muag tsis zoo xws li kev sib tsoo thiab hluav taws xob nyob rau hauv ntau cov txheej txheem reflow soldering thiab cov khoom siv tam sim no. Copper core balls (CCSB), nrog lawv cov qauv tshwj xeeb,
tuav pob qhov chaw ruaj khov thiab txhawb nqa ntau- txheej txheej. Nyob rau hauv 3D ntim, chips undergo ntau reflow soldering txheej txheem. Cov khoom siv niaj hnub ua kom yaj tag ntawm 250℃thiab nws tuaj yeem tawg nyob rau hauv lub siab ntawm sab sauv - txheej txheej, ua rau luv luv Circuit Court. Txawm li cas los xij, cov tub ntxhais tooj liab ntawm cov tub ntxhais tooj liab pob muaj qhov melting point siab txog 1083 degree, cov khoom seem thaum lub sij hawm soldering, zoo txhawb cov pob khoob, tiv thaiv deformation thiab bridging, thiab ua kom muaj kev ncaj ncees ntawm HBM multi- txheej DRAM stacks.
Txhim kho electrothermal kev ua tau zoo kom ua tau raws li kev siv hluav taws xob siab ntawm AI chips.
Nrog rau conductivity 5-10 npaug ntawm cov pob solder, nws txo qhov ceev tam sim no, suppresses electromigration, txuas lub neej kev sib koom tes, thiab ua kom muaj kev ruaj ntseg ntawm AI kev cob qhia chips nyob rau hauv ntev - lub sij hawm ua haujlwm siab.
Superior thermal conductivity pab kom sai sai dissipate tshav kub los ntawm HBM thiab GPU cores, alleviating "kub qhov chaw" teeb meem thiab txhim kho tag nrho cov kev cia siab ntawm system.
