Core Specifications
| Khoom siv | Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead) |
| Txoj kab uas hla | 0.2mm txog 0.76mm (Standard)|Custom Size Muaj |
| Ua siab ntev | <5μm Precision (±0.005mm) |
| Melting Point | Txheem 183 degree|Kev cai Melting Points xaiv tau |
| Ntim | 250,000 pcs / lub raj mis, Nqus -Sealed Anti-Oxidation |
Qhov Zoo Tshaj Plaws
Superior Solderability:
Ua kom cov voiding tsawg tsawg thiab ci ntsa iab, txhim khu kev qha pob qij txha rau siab -PCB sib dhos.
Thermal stability:
Eutectic muaj pes tsawg leeg tiv thaiv theem sib cais, txo qhov mob khaub thuas pob qij txha.
Customization:
Tailor txoj kab uas hla / melting point rau kev siv tshwj xeeb (xws li, qis-kub Bi58 alloys).
Daim ntawv thov
BGA / Chip Ntim:
Zoo tagnrho rau flip-chip, CSP, thiab micro-BGA underfills.
Precision Electronics:
Micro-kev sib txuas hauv cov sensors, cov cuab yeej kho mob, thiab aerospace modules.
Electroplating Anodes:
Uniform spheres rau zoo ib yam plating thickness.
Quality & Ua raws cai
- Cov Qauv: Ua raws li IPC & RoHS kev zam rau cov khoom siv hluav taws xob tseem ceeb.
- Kev ntsuam xyuas: 100% optical soj ntsuam, shear zog Ntau dua los yog sib npaug rau 45MPa.
Cim npe nrov: sn63pb37 0.2mm, Tuam Tshoj sn63pb37 0.2mm manufacturers, lwm tus neeg, Hoobkas