"Copper core balls" feem ntau yog xa mus rau cov khoom siv hluav taws xob kheej kheej nrog cov tub ntxhais tooj liab siv hauv cov khoom siv hluav taws xob. Lawv muaj ib tug ntshiab tooj liab core thiab ib tug nto plating (xws li tin alloy, npib tsib xee, thiab lwm yam) tsim ib tug kheej kheej qauv siv rau siab - kev ntseeg tau ntawm hluav taws xob interconnects, xws li BGA (Ball Grid Array) thiab CSP (Chip Scale Package).
Lub hauv paus ntsiab lus ua haujlwm ntawm cov pob tooj liab hauv 3D ntim yog ua raws li lawv cov txheej txheem ntau - txheej thiab cov khoom sib koom ua ke. Lub siab - melting- cov ntsiab lus tooj liab tswj cov thermal stability, ua kom pom cov hluav taws xob zoo thiab thermal conductivity, thiab ua kom pom qhov zoo tshaj plaws kev ntseeg siab thaum lub sij hawm ntau reflows. Nws yog cov cuab yeej txhawb nqa tseem ceeb rau kev ua tiav siab - ntom ntom stacking.
Lub hauv paus ntsiab lus: Ib qho tseem ceeb ntawm cov khoom siv hluav taws xob zoo heev, thermally conductive, thiab siab - lub zog ntshiab tooj liab yog siv, nrog rau txheej txheej txheej plated nrog cov khoom siv solderable (xws li tin -silver tooj liab SAC305), sib txuas cov tshuab ruaj khov ntawm tooj liab nrog cov plating zoo heev.
