Cov pob tooj liab yog cov khoom sib txuas tseem ceeb rau 3D ntim, HBM nco stacking, siab- kev sib xyaw ua ke ntawm AI chips thiab siab - kawg GPUs, thiab siab - kev ua tau zoo suav. Lawv cov qauv kev ruaj ntseg thiab zoo heev electrothermal kev ua tau zoo txhawb ntau- txheej txheej txheej txheej thiab txhim kho kev ntseeg tau.
3D Ntim: Cov Qauv Txheej Txheem rau Siab -Density Stacking
Nyob rau hauv 3D ntim, ntau lub chips yog vertically stacked nyob rau hauv tib lub pob, yuav tsum tau ntau reflow soldering txheej txheem. Cov khoom siv niaj hnub, tom qab melting ntawm qhov kub thiab txias, nws yooj yim rau kev tawg nyob rau hauv lub gravitational siab, ua rau luv luv circuits. Copper core balls, nrog rau lawv cov tub ntxhais tooj liab melting point ntawm 1083 degree, nyob twj ywm thaum lub sij hawm reflow soldering ntawm ib ncig ntawm 250 degree, zoo tswj kev sib koom ua ke qhov sib txawv, tiv thaiv deformation thiab bridging, thiab ua kom ruaj khov ntawm ntau - txheej txheej.
HBM Memory Stacking: Qhov Kev Pabcuam Tseem Ceeb rau Kev Txhaum "Memory Wall"
High-bandwidth nco (HBM) ua tiav TB/s-qib cov ntaub ntawv hloov pauv los ntawm vertically stacking ntau txheej ntawm DRAM chips. Cov qauv no tso siab heev xav tau ntawm kev sib koom ua ke kev ntseeg tau. Copper core balls tsis tsuas yog ua kom lub cev qhov chaw ruaj khov ntawm ntau DRAM txheej hauv HBM tab sis kuj, nrog rau lawv cov conductivity 5-10 npaug ntawm cov khoom siv, txo qhov ceev tam sim no, txo cov electromigration, thiab txuas ntxiv kev nco lub neej.
AI Chips: Qhov Kev Xaiv Zoo Tshaj Plaws rau Kev Siv Hluav Taws Xob thiab Kev Siv Hluav Taws Xob Siab Tam Sim No AI kev cob qhia chips (xws li NVIDIA H100) tuaj yeem haus ntau pua watts thaum lub sijhawm ua haujlwm, nrog rau cov neeg hauv zos tam sim no siab heev. Lub siab conductivity thiab thermal conductivity ntawm tooj liab spheres pab txo cov teeb liab latency, txhim kho lub zog efficiency, thiab sai sai dissipate tshav kub, alleviating hotspot teeb meem. Lawv qhov zoo hauv electromigration kuj thiab poob siab ua haujlwm kom ruaj khov ntawm AI chips nyob rau hauv ntev - lub sij hawm siab loads.
High-GPU ntim: Ua kom siab-Kev ua tau zoo Graphics thiab xam niaj hnub siab-kG GPUs siv Chiplet tsim thiab 2.5D / 3D ntim tshuab los koom ua ke cov tub ntxhais hauv computer thiab HBM nco los ntawm silicon interposer. Copper core balls, ua qhov nruab nrab ntawm kev sib txuas ntsug nruab nrab ntawm cov nti thiab cov interposer, tsis yog sib xws nrog cov pob uas twb muaj lawm - cov khoom siv thiab cov txheej txheem reflow tab sis kuj muaj kev ruaj ntseg kev sib txuas thaum lub sij hawm ntau lub voj voog thermal, ua rau lawv yog ib feem tseem ceeb rau kev ua tiav siab -bandwidth, qis -latency kev sib txuas lus.
