Lub Copper Core Solder Ball (CCSB) yog lub siab -kev ua tau zoo ntawm cov khoom siv sib xyaw siv hauv 3D ntim tshuab. Nws muaj cov tub ntxhais tooj liab, nrog npib tsib xee thiab tin plating ntawm cov txheej txheej sab nrauv, muab hluav taws xob thiab thermal conductivity, thiab zoo heev tiv thaiv deformation.
Lub Copper Core Solder Ball (CCSB) yog ib qho kev hloov kho dua tshiab rau cov khoom siv BGA solder ib txwm, tsim tshwj xeeb kom tau raws li qhov xav tau ntawm siab - ntom, ntau- txheej txheej ntim khoom siv hluav taws xob siab heev. Nws cov qauv muaj peb ntu:
Copper Core: Feem ntau 0.03-0.5 mm nyob rau hauv txoj kab uas hla, nrog ib tug melting point siab li 1083 degree, deb tshaj qhov reflow soldering kub (kwv yees li 250 degree), xyuas kom meej tias nws tsis yaj los yog deform thaum lub sij hawm ntau thermal cycles, tswj pob qhov chaw stability.
Nickel Plating: Kwv yees li 2-3 μm tuab, siv los tiv thaiv kev sib txawv ntawm tooj liab thiab cov hlau substrate, txhim kho kev ntseeg tau ntawm cov khoom siv.
Solder Plating: Ua los ntawm cov tin ntshiab, txhuas - dawb alloys xws li SAC305, thiab lwm yam., lub luag hauj lwm rau qhov tseeb solder kev twb kev txuas.
