Cov khoom siv ntawm CCGA solder pob yog peb- txheej txheej txheej: txheej txheej sab hauv ntawm siab- tooj liab purity, nruab nrab txheej xaiv plated nrog npib tsib xee, thiab txheej txheej txheej ntawm tin-raws li solder plating (xws li SAC305 lossis ntshiab tin).
Copper Core Solder Ball (CCSB) yog lub siab -cov khoom siv sib txuas ua haujlwm tsim tshwj xeeb rau kev ntim khoom 3D siab heev. Nws cov ntaub ntawv muaj pes tsawg leeg ncaj qha txiav txim siab nws cov kev ua tau zoo hauv siab - ntom, siab - kev ntseeg tau.
Sab hauv txheej: High-purity tooj liab (Copper Core) Ua los ntawm electrolytic tooj liab, feem ntau muaj purity siab dua 99.9%, thiab ib txoj kab uas hla ntawm 0.03-0.5 hli.
Tooj liab muaj qhov melting point siab li 1083 degree, deb tshaj qhov reflow soldering kub (kwv yees li 250 degree), yog li cov khoom tseem tshuav nyob rau hauv ntau lub thermal cycles, ua lub luag haujlwm tseem ceeb hauv kev txhawb nqa pob qhov chaw thiab tiv thaiv kev tawg.
Nruab Nrab Txheej: Nickel Plating (yeem) Kwv yees li 2-3 μm tuab, tso rau saum npoo ntawm pob tooj liab los ntawm electroplating. Nws lub luag haujlwm tseem ceeb yog txhawm rau txhawm rau cuam tshuam qhov sib txawv ntawm cov tooj liab thiab cov tin sab nraud -raws li solder, tiv thaiv kev tsim ntawm IMCs (xws li Cu₆Sn₅) thiab txhim kho lub sij hawm ntev - kev cia siab ntawm kev sib koom ua ke. Seb puas ntxiv cov txheej no nyob ntawm cov khoom siv substrate thiab cov txheej txheem yuav tsum tau ua.
Txheej txheej: Solder txheej
Feem ntau tsim los ntawm SAC305 (Sn-3.0Ag-0.5Cu), ntshiab tin (Sn), lossis SC alloy, nrog lub thickness ntawm 3-30μm.
Thaum lub sij hawm reflow soldering, nws melts thiab tsim ib tug metallurgical daim ntawv cog lus nrog lub PCB pads, ua tiav cov hluav taws xob thiab cov neeg kho tshuab kev sib txuas, thaum lub hauv paus tooj liab tseem tsis hloov, ua tiav ib tug ruaj khov soldering mechanism ntawm "sab nraud melting thiab internal solidification".
