Copper core solder balls (CCSBs) muaj peb - txheej txheej txheej: txheej txheej ntawm siab- purity tooj liab npas (0.03-0.5 mm inch), nruab nrab txheej ntawm 2-3 μm nickel plating (yeem), thiab txheej txheej ntawm 3-30 μm ob qho tib si muab kev txhawb nqa AC (5 μm) solderability.
Copper core solder balls (CCSBs) yog siab -cov ntaub ntawv sib txuas ua haujlwm tshwj xeeb tsim los rau siab - ntim 3D. Lawv cov qauv tshwj xeeb daws cov teeb meem ntawm lub cev qhuav dej thiab luv luv uas tshwm sim nrog cov khoom siv sib xyaw ua ke thaum rov ua dua.
Copper Core Ball: Muab Kev Pabcuam Mechanical thiab Thermal Stability
Ua los ntawm siab -purity electrolytic tooj liab, nws txoj kab uas hla feem ntau yog nruab nrab ntawm 0.03-0.5 hli, tsim cov txheej txheem nruj ntawm tag nrho cov qauv.
Tooj liab muaj qhov melting point siab li 1083 degree, deb tshaj qhov reflow soldering kub (kwv yees li 250 degree), yog li cov khoom seem nyob rau hauv ntau lub thermal cycles. Qhov no zoo tswj lub cev qhov chaw nruab nrab ntawm cov chip stacks, tiv thaiv PKG (pob lub cev) compression thiab deformation.
Nickel Plating Txheej: Inhibits Intermetallic Diffusion (Yeem Txheej Txheej Txheem)
Feem ntau 2-3 μm tuab, nws yog tso rau saum npoo ntawm lub pob tooj liab los ntawm electroplating lossis tshuaj plating.
Nws lub luag haujlwm tseem ceeb yog tiv thaiv kev sib cuam tshuam ntawm tooj liab thiab lwm yam solder (xws li tin) ntawm qhov kub thiab txias, zam kev tsim cov nkig intermetallic compounds (IMCs) thiab txhim kho lub sijhawm ntev - kev ntseeg siab ntawm cov pob qij txha.
Cov txheej no yog ib qho kev xaiv tsim, thiab nws qhov sib ntxiv yog nyob ntawm cov khoom siv substrate (xws li OSP, ENIG) thiab cov txheej txheem yuav tsum tau ua.
