CCGA (Ceramic Pillar Grid Array) daim ntawv cog lus yog ib qho kev txhim kho ntawm CBGA (Ceramic Ball Grid Array), siv cov pillars es tsis txhob siv cov khoom siv. Lawv yog tshwj xeeb tshaj yog haum rau loj - pob loj (feem ntau loj dua 32mm × 32mm) thiab siab - kev ntseeg siab, xws li aerospace, tub rog, satellite, thiab siab - kawg industrial tswj. Lawv cov txiaj ntsig tseem ceeb yog los ntawm kev txo qis ntawm thermal mismatch kev ntxhov siab los ntawm cov qauv kev sib cog lus.
Zoo dua Fatigue Resistance: Qhov siab dua qhov sib txuas ntawm cov ncej hlau tso cai rau lawv nqus cov kev ntxhov siab los ntawm kev khoov deformation thaum lub caij kub, txo qhov kev pheej hmoo ntawm kev sib koom ua ke tawg. Qhov no muaj txiaj ntsig tshwj xeeb hauv kev txo qis qhov tsis sib xws hauv coefficient ntawm thermal expansion (CTE) ntawm cov ceramic substrate (CTE ≈ 7.5 ppm / degree) thiab epoxy PCB (CTE ≈ 17.5 ppm /℃).
Superior Thaum tshav kub kub Dissipation: Cov qauv pillar muab ib txoj hauv kev ruaj khov thaum tshav kub kub, ua kom muaj cua sov kom zoo los ntawm cov nti mus rau PCB thiab txhim kho tag nrho cov thermal tswj kev muaj peev xwm.
Kub Kub, Siab Siab, thiab noo noo Resistance: CCGA solder pillars feem ntau siv siab -cov hlau lead (xws li Pb90/Sn10, Pb80/Sn20), muab kev tiv thaiv zoo rau ib puag ncig kev ntxhov siab thiab ua rau lawv haum rau huab cua kub, av noo, lossis qhov chaw nqus.
Support for Higher I/O Density and Larger Package Sizes: Compared to CBGA, CCGA allows for finer solder pillar pitches (such as 0.5mm, 0.65mm) and higher pin counts (up to 1000+). (pins) kom tau raws li qhov kev xav tau ntawm kev sib txuas ntawm siab -cov chips ceev xws li FPGAs, MRAMs, thiab siab - processors ceev.
