Cov ntsiab lus tseem ceeb ntawm cov khoom siv tooj liab muaj xws li thermal stability (copper core tsis yaj), siab conductivity (5-10 npaug ntawm cov khoom siv), thermal conductivity, zoo heev electromigration resistance, shock resistance, thiab qhov chaw tuav tom qab reflow soldering. Lawv yog cov khoom siv sib txuas tseem ceeb uas txhawb nqa cov ntim 3D siab.
Copper core melting point Ntau dua los yog sib npaug rau 1083 degree, deb tshaj qhov reflow soldering kub (kwv yees li 250 degree), xyuas kom nws tsis yaj los yog deform thaum lub sij hawm ntau thermal cycles, zoo tswj lub cev qhov sib txawv ntawm nti pawg.
Thaum lub sij hawm ntau- txheej reflow soldering nyob rau hauv 3D ntim, nws zam cov teeb meem xws li solder sib koom ua ke sib tsoo thiab bridging luv luv Circuit Court, kom ntseeg tau cov qauv kev ncaj ncees ntawm multi- txheej DRAM stacks xws li HBM.
Dimensional stability: Lub siab melting point ntawm cov tub ntxhais tooj liab (kwv yees li 1080 degree) tso cai rau nws kom nyob twj ywm nyob rau hauv tus txheej txheem soldering kub ntau yam, uas yog ib qho tseem ceeb rau ua kom tiav 3D ntim.
Mechanical ntseeg tau: suav nrog kub cycling kuj thiab mechanical shock resistance (xws li kev ntsuas poob). Cov kev tshawb fawb tau pom tias qee yam ntawm cov khoom siv tooj liab ua tau zoo dua los yog sib npaug rau cov khoom siv siab -silver solders hauv qhov no.
Hluav taws xob thiab Thermal Properties: Copper muab cov hluav taws xob zoo heev thiab thermal conductivity, thaum sab nrauv nickel plating zoo inhibits tooj liab diffusion thiab txhim khu kev tiv thaiv rau electromigration, ua rau nws haum rau siab tam sim no daim ntaub ntawv.
