Tuam Tshoj 3D- ntim cov tub ntxhais tooj liab sphere lag luam tau txog kwv yees li RMB 950 lab hauv 2023 thiab tau kwv yees kom tshaj RMB 1.7 billion los ntawm 2030, nrog rau CAGR thoob ntiaj teb ntawm 8.2%.
Tam sim no, kev lag luam thov rau tooj liab spheres (CCSB) yog tsis tu ncua nce nrog kev nrov ntawm cov khoom ntim siab heev. Nws lub zog tsav tseem ceeb los ntawm kev loj hlob tawg ntawm siab -kev ua tau zoo, AI chips, thiab siab -bandwidth nco (HBM). Cov hauv qab no yog ib qho kev ntsuam xyuas tseem ceeb ntawm kev ua lag luam xav tau:
HBM Memory Stacking: Hauv AI kev cob qhia thiab cov ntaub ntawv chaw qhov xwm txheej, HBM ua tiav TB/s-theem bandwidth los ntawm ntau- txheej DRAM ntsug stacking, muab qhov xav tau siab heev ntawm thermal stability thiab kev ntseeg siab ntawm cov pob qij txha. Copper core spheres, vim lawv qhov tsis yog -collapse yam ntxwv thaum lub sij hawm ntau reflows, tau dhau los ua cov kev sib txuas kev daws teeb meem rau HBM ntim.
AI Chips thiab High-Xaiv GPUs: AI accelerators xws li NVIDIA H100 ntiav Chiplet architecture thiab 3D ntim, tso siab rau cov tub ntxhais tooj liab spheres kom ua tiav siab - ntom, siab - kev ntseeg siab ntawm kev sib txuas ntawm logic chips thiab HBMs ntau pua ntawm kev siv zog tam sim no.
Automotive electronics thiab industrial controls: Nyob rau hauv siab - kev ntseeg siab xws li automotive electronics, copper core balls have better shock resistance than traditional solder balls and are suited for heavy working environment.
