Copper core balls, tseem hu ua tooj liab core solder balls los yog tooj liab -cov tub ntxhais cov khoom, yog cov khoom sib xyaw ua ke nrog cov tub ntxhais tooj liab thiab txheej txheej txheej plated nrog npib tsib xee thiab tin, tsim ntau - txheej txheej. Lawv cov yam ntxwv tseem ceeb yog cov tub ntxhais tooj liab tsis yaj ntawm qhov kub thiab txias, tswj qhov ntev geometric ruaj khov. This gives them a significant advantage in advanced semiconductor assembly fields such as high-density 3D packaging, narrow-pitch packaging, and high-performance area array packaging.
Ntim Hom: Cov khoom siv tooj liab feem ntau yog siv hauv 3D ntim (xws li stacked nti- ntawm - pob), wafer- qib nti- nplai ntim (WLCSP), thiab thaj chaw ntim ntim uas yuav tsum tau muaj kev ntseeg siab. Lawv cov txiaj ntsig tseem ceeb nyob hauv kev ua kom ruaj khov ntawm cov pob khoom tom qab ntau lub voj voog rov ua dua, tiv thaiv kev sib koom tes sib koom ua ke lossis txuas txuas luv luv.
Qhov Loj Specifications: Txoj kab uas hla ntawm lub pob tooj liab tseem ceeb yog qhov tseem ceeb. Kev lag luam feem ntau categorizes lawv los ntawm qhov loj me: tsawg dua 200 micrometers, 200-500 micrometers, thiab ntau dua 500 micrometers.
Kev xaiv meej yog yuav tsum tau ua raws li cov nti electrode ncoo loj, pob suab, thiab qhov yuav tsum tau sib txawv. Piv txwv li, tooj liab core solder balls nrog ib txoj kab uas hla ntawm 0.3 mm tau raug kawm ntau thiab siv.
