Solder solder balls yog spherical engineering cov ntaub ntawv ua los ntawm siab -purity tin los yog tin alloys, feem ntau yog siv nyob rau hauv electronics ntim, semiconductor integrated Circuit Court los ua ke, thiab tshuaj lom neeg ntau lawm. Lawv cov qauv tsim los ntawm Taiwan, thaum cov txheej txheem tsim khoom sib koom ua ke los ntawm Nyiv, Lub Tebchaws Yelemees, thiab Tebchaws Meskas. Lawv siv ESD los tiv thaiv- ntim khoom zoo li qub thiab cov kev qhia tshwj xeeb kom ua tau raws li kev xav tau ntawm kev lag luam.
Cov khoom no muaj cov micron - theem txoj kab uas hla tolerances (qhov tsawg kawg nkaus txoj kab uas hla 0.14mm), cov ntsiab lus oxygen tsawg, thiab siab conductivity, dhau ntau cov qauv ntsuas nrog rau cov alloy muaj pes tsawg leeg thiab reflow kev ua tau zoo. In the electronics field, solder balls serve as key connectors for BGA/CSP packages, replacing traditional pins to achieve high-density surface mount technology. Lawv tau sib xws nrog PCB tin plating txheej txheem thiab laser vuam tshuab. Cov txheej txheem tsim khoom suav nrog lub pob txoj kab uas hla kev tsim, tshuaj xyuas kho qhov muag, thiab cov hlau lead-kev kho dawb, siv cov pwm pwm txias tsim thiab cov khoom siv tshem tawm plua plav ib puag ncig. Nyob ntawm daim ntawv thov, lawv muaj nyob rau hauv cov hlau lead thiab lead- hom dawb thiab xav tau cov ntawv pov thawj kev ntseeg tau xws li tsheb - qib kev ntsuas kev txiav.
