Qhov sib txawv tseem ceeb ntawm cov khoom siv tooj liab thiab cov khoom siv ib txwm muaj nyob hauv lawv cov qauv, thermal stability, thiab electrothermal kev ua tau zoo:
Copper core balls siv high -melting- taw tes tooj liab ua lawv cov tub ntxhais, tiv thaiv kev sib koom ua ke sib tsoo hauv 3D ntim. Lawv muaj zog hluav taws xob thiab thermal conductivity thiab tsis kam mus rau electromigration. Cov khoom siv tshuaj pleev ib ce, ntawm qhov tod tes, nws yooj yim rau deformation tom qab ntau reflows thiab yog haum rau cov pa ntim daim ntaub ntawv.
Thermal Stability thiab ntim Adaptability: tooj liab muaj qhov melting point siab li 1083 degree, deb tshaj qhov reflow soldering kub (kwv yees li 250 degree). Yog li ntawd, cov tub ntxhais tooj liab yuav tsis yaj thaum lub sij hawm ntau lub voj voog thermal, tswj qhov chaw ntim ruaj khov, ua rau nws tshwj xeeb tshaj yog tsim rau cov txheej txheem uas yuav tsum tau muaj ntau yam reflows, xws li 3D stacked ntim.
Cov khoom siv niaj hnub yaj tag nrho ntawm 250 degree. Hauv ntau- txheej txheej txheej txheej, lawv muaj feem cuam tshuam rau kev sib koom ua ke ntawm kev sib tsoo, kev sib txuas, thiab luv luv Circuit Court vim lub siab los ntawm qhov hnyav ntawm cov khoom sab saud, txwv tsis pub siv cov khoom ntim siab - ntom ntom.
Copper Core Balls (CCSB): Cov qauv sib xyaw uas muaj cov tub ntxhais tooj liab + npib tsib xee plating txheej + txheej txheej plating. Cov tub ntxhais tooj liab feem ntau muaj txoj kab uas hla ntawm 0.03-0.5 hli, nrog rau txheej txheej ntawm cov tin solderable-raws li alloy (xws li SAC305), ua haujlwm rau kev txhawb nqa thiab vuam ua haujlwm.
Cov khoom siv niaj hnub: Ua tag nrho ntawm cov tin lossis tin alloys (xws li Sn63 / Pb37, SAC305), lawv tau koom nrog hauv cov txheej txheem molten soldering thiab nws nquag deformation ntawm qhov kub thiab txias.
