Thaum xaiv tooj liab qhwv cov ntaub qhwv cov ntawv, cov ntsiab lus tseem ceeb suav nrog cov khoom muaj pes tsawg leeg, cov qauv tsis sib xws, txheej txheem sib xws, thiab kev kam rau ib puag ncig. Tshwj xeeb tshaj yog nyob rau hauv siab - kev ntseeg siab xws li aerospace thiab tub rog, qhov tseem ceeb yuav tsum tau muab rau cov khoom uas muaj tooj liab ntxiv dag zog, eutectic solder txheej, thiab pov thawj thermal cycling thiab vibration testability.
Main Post Khoom: 80Pb / 20Sn solder posts yog nyiam, raws li lawv ductility thiab thermal qaug zog lub neej yog superior rau 90Pb / 10Sn.
Cov Txheej Txheem Txhim Kho: Cov txheej txheej sab nrauv yuav tsum yog 0.051mm tuab tooj liab ntawv qhwv ib ncig ntawm tus ncej thiab tag nrho npog nrog 63Sn / 37Pb eutectic solder. Cov qauv no txhim kho shear tsis kam thiab thermal conductivity.
Qhov Loj Specifications: Cov qauv qauv yog Φ19 × 19mm lossis Φ12.7 × 25.4mm. Rau siab - ntim ntim, nws yog ib qho tsim nyog kom paub meej tias kev cai miniaturization puas txaus siab.
Reflow Soldering Parameter Matching: Raws li kev tshaj tawm - kev tshawb fawb cov txheej txheem mounting, qhov zoo tshaj plaws ua ke yog: solder ncej puab txoj kab uas hla 0.40mm, ncej siab 3.81mm, solder paste thickness 30μm, thiab txias npaum li cas 2.0℃/s. Thaum yuav khoom, thov reflow profile cov lus pom zoo los ntawm tus neeg muag khoom.
Solder Paste Type Matching: Nws raug nquahu kom siv qis -oxygen, siab- ua haujlwm tsis muaj- ntxuav cov tshuaj txhuam kom tsis txhob muaj cov voids lossis cov dej tsis zoo.
Thib ob Reflow Tolerance: Paub meej tias cov khoom tuaj yeem tiv taus yam tsawg kawg ob lub voj voog rov ua dua tshiab (qhov kub siab tshaj qhov qis dua lossis sib npaug li 220 degree) kom tsis txhob muaj kev sib koom ua ke degradation thaum lub sij hawm encapsulation.
Thermal Cycling Performance: Yuav tsum dhau 500 lub voj voog ntawm kev sim los ntawm -65℃mus rau +125 degree, tsis muaj kab nrib pleb hauv cov pob qij txha thiab lub zog shear attenuation<15%.
Kev vibration thiab Shock Test: Yuav tsum ua raws li GJB548B-2005 Method 2003/2004 tus qauv, tsis muaj kev sib txuas tsis ua haujlwm raws li 20G acceleration.
Ntev - Lub Sij Hawm Cia ruaj khov: Lub ntsej muag eutectic solder yuav tsum muaj cov tshuaj tiv thaiv - oxidation txheej kom ntseeg tau zoo solderability rau 6 lub hlis.
