Xaiv cov khoom siv los ntawm cov ntawv thov yog qhov tseem ceeb, vim nws cuam tshuam nrog cov hom pob, cov kev xav tau ntawm kev ntseeg siab, cov txheej txheem sib xws, thiab cov hom phiaj ntawm cov nqi. Qhov no yog ib qho tseem ceeb tshwj xeeb hauv kev thov xws li BGA / CSP, flip chips, thiab automotive electronics, qhov twg alloy muaj pes tsawg leeg, pob txoj kab uas hla precision, melting point yam ntxwv, thiab ib puag ncig yuav tsum tau txiav txim siab.
Lead Solder Balls: Tsim nyog rau kev siv ib txwm siv uas tus nqi yog qhov rhiab heev thiab kev txwv ib puag ncig tsis yog qhov tseem ceeb.
Alloy Hom: Feem ntau Sn63 / Pb37 (melting point 183 degree), nrog rau qhov tsis tshua muaj melting point, zoo wettability, thiab lub qhov rais txheej txheem dav.
Muaj cov tswj vaj huam sib luag, cov khoom siv hluav taws xob hauv tsev, thiab lwm yam khoom siv tsis yog -cov khoom siv hluav taws xob. Kuj tseem tsim nyog rau cov chaw tsim khoom uas txhim kho cov kab ntau lawm yog qhov nyuaj thiab cov khoom siv lead ua - tseem siv tau.
Lead-Pub Solder Balls: Qhov kev xaiv tseem ceeb tam sim no, ua tau raws li ib puag ncig thiab siab - kev ua tau zoo.
Mainstream Alloy: Sn96.5Ag3.0Cu0.5 (SAC305), melting point kwv yees li 217-220 degree, muaj zog txhua yam thiab qaug zog.
Cov khoom siv hluav taws xob siv xws li smartphones, laptops, thiab TWS earphones. Siab - qhov yuav tsum tau muaj kev sib txuas ceev rau 5G kev sib txuas lus modules, AI nti ntim, thiab lwm yam.
Qhov zoo: Ua raws li RoHS, WEEE thiab lwm cov lus qhia ib puag ncig; txhawb automated reflow soldering ntau lawm.
