Sn-Plated CuB

Sn-Plated CuB (Tin-Plated Copper Core) Solder Balls sawv cev rau kev nce qib hauv kev sib txuas thev naus laus zis, tsim los txuas qhov sib txawv ntawm kev ua tau zoo ntawm hluav taws xob zoo thiab kev ntseeg siab ntawm kev siv tshuab. Ntawm lawv cov tub ntxhais yog qhov siab -purity tooj liab kheej kheej, muab tshwj xeeb thermal thiab hluav taws xob conductivity. Cov tub ntxhais no tom qab ntawd raug coated nrog ib txheej txheej ntawm tin (Sn) plating, tsim kom muaj cov qauv sib xyaw uas sib xyaw ua ke zoo tshaj plaws ntawm ob qho tib si hlau. Qhov tshwm sim yog ib qho kev daws teeb meem zoo tshaj plaws rau qhov xav tau tshaj plaws Ball Grid Array (BGA), Chip Scale Package (CSP), thiab flip-chip daim ntawv thov uas sib koom ua ke, tsis muaj hluav taws xob tsis zoo, thiab kev coj tus cwj pwm zoo sib xws tsis yog - sib tham.

Kev tsim tshwj xeeb ntawm Sn-Plated CuB solder balls muab cov khoom sib txawv ntawm qhov sib txawv ntawm homogeneous alloy spheres. Cov tub ntxhais tooj liab ua raws li tus ncej uas tsis yog- melting pillar thaum lub sij hawm reflow txheej txheem, pab tswj standoff qhov siab thiab tiv thaiv lub taub hau- hauv- hauv ncoo (HiP) los yog tsis yog - ntub qhib (NWO) tsis xws luag nyob rau hauv ultra- zoo- suab sib dhos. Qhov no yog qhov tseem ceeb rau kev tswj hwm coplanarity nyob rau hauv loj, ntom arrays.

Sab nrauv tin plating ua kom zoo heev solderability thiab cov ntaub ntawv txhim khu kev qha intermetallic compounds (IMCs) nrog rau cov substrate pads. Ib qho tseem ceeb feature yog customizable tin plating thickness. Peb muaj ntau yam txheej txheem plating xaiv (xws li, 3-5µm, 5-8µm) thiab tuaj yeem kho cov ntsiab lus ntawm cov tin kom tau raws li cov neeg siv khoom tshwj xeeb rau cov khoom siv sib koom ua ke, IMC tsim kinetics, lossis sib haum nrog cov txheej txheem sib txawv (ENIG, Immersion Sn, OSP).

Cov khoom no ua tau zoo nyob rau hauv daim ntawv thov uas xav tau kev ua haujlwm siab thermal cycling kev ua tau zoo thiab tsis kam mus rau mechanical shock. Cov tub ntxhais tooj liab lub zog txo qhov kev pheej hmoo ntawm kev sib koom ua ke tawg hauv kev ntxhov siab. Tsis tas li ntawd, cov qauv sib xyaw tuaj yeem pab txo cov teeb meem xws li tin whisker kev loj hlob piv rau cov tin tiav, txhim kho lub sijhawm ntev - kev cia siab rau tsheb, aerospace, thiab siab - kev ua tau zoo ntawm kev suav.

Muaj nyob rau hauv txoj kab uas hla ntawm 0.1mm mus rau 0.76mm nrog nruj txoj kab uas hla kam rau ua (feem ntau ± 10µm), peb Sn -Plated CuB npas kom zoo ib yam luam ntawv thiab tso. Lawv tau sib xws nrog cov qauv txhuas -dawb (SAC305, thiab lwm yam) thiab cov hlau lead- uas muaj cov tshuaj txhuam hniav, muab cov qauv tsim kom yooj yim.

Hauv kev ua lag luam uas xav tau kev ntseeg siab dua thiab kev ua haujlwm me me, Sn-Plated CuB solder balls muab cov kev daws teeb meem. Lawv tsis yog lwm qhov kev tivthaiv tab sis kev txhim kho kev ntseeg siab rau koj pob. Peb cov txheej txheem tsim khoom ua kom muaj qhov tshwj xeeb, tsis muaj oxidation, thiab zoo ib yam plating zoo, txhawb nqa los ntawm tag nrho traceability thiab ua raws li RoHS thiab lwm yam kev lag luam cov qauv.

Txawm hais tias koj tab tom tsim - tiam GPUs, tus tsav tsheb siab tshaj - kev pab cuam (ADAS), lossis lub luag haujlwm- kho vajtse kev sib txuas lus tseem ceeb, peb pab neeg tau npaj siab los koom tes. Peb muab daim ntawv thov- kev txhawb nqa tshwj xeeb thiab tuaj yeem tsim kho cov tins kev cai -plating profiles los txhim kho kev ua tau zoo rau koj cov txheej txheem sib dhos tshwj xeeb thiab cov hom phiaj kev ntseeg siab.