Technical Specifications
|
Alloy Composition |
Sn96.5 / Ag3.0 / Cu0.5 (Lead-Dawb / RoHS raws) |
|
Melting Point |
217℃- 219 degree |
|
Qhov ntom |
7.4 g / cm³ |
|
Txheem Diameter |
Muaj los ntawm 0.05mm txog 2.0mm |
|
Kev kho kom haum |
Peb muab kev cai txoj kab uas hla scaling (xws li, 0.55 mm) kom haum rau koj cov substrate tshwj xeeb tsim thiab pitch xav tau. |
Core Advantages & Quality Assurance
Peb nkag siab tias hauv kev tsim khoom semiconductor, txawm tias micron - theem sib txawv tuaj yeem cuam tshuam cov txiaj ntsig. KINSTREAM ua kom muaj kev lag luam- ua kom sib xws los ntawm:
Zoo meej Sphericity & Dimensional raug
Kev siv thev naus laus zis thev naus laus zis ua kom cov pob kheej kheej kheej kheej nrog ultra- nruj txoj kab uas hla, ua kom yooj yim seamless automated qhov chaw.
Superior Oxidation Control
Cov ntsiab lus tsis tshua muaj oxide nyob rau ntawm qhov chaw ua kom cov ntub dej zoo heev thiab txo qhov kev pheej hmoo ntawm "voiding" thaum lub sij hawm reflow txheej txheem, txhim kho solderability.
Kev nruj nruj-rau- Ntau yam sib xws
Txhua batch tau nruj me ntsis micro- kev tshuaj xyuas cov qauv thiab tshuaj ntsuam xyuas kom ntseeg tau tias cov hlau tsis sib xws thiab cov khoom siv dag zog.
Optimized Micro- qauv
Peb qhov chaw tsim khoom tswj tau ua kom muaj cov qauv ua kom zoo dua qub, txhim kho lub sijhawm ntev - kev ntseeg siab ntawm cov pob qij txha nyob rau hauv thermal stress.
Thawj Daim Ntawv Thov Scenarios
KINSTREAM SAC305 solder balls yog qhov kev xaiv zoo tshaj plaws rau siab - ntim khoom siv hluav taws xob ceev:
BGA & CSP Rework
Muab kev sib txuas hluav taws xob ruaj khov rau siab -pin- suav cov khoom.
Semiconductor Ntim
Ua rau tom ntej -gen miniaturization rau mobile, tsheb, thiab khoom siv hluav taws xob.
Wafer -Theem Ntim (WLP)
Txhawb nqa zoo -pitch bumping rau qib siab nti- nplai kev daws teeb meem.
Cim npe nrov: Tuam Tshoj txheem sac 0.6mm, Tuam Tshoj txheem sac 0.6mm manufacturers, lwm tus neeg, Hoobkas
