High Ag SAC

High Ag SAC

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Melting Point: ~ 217℃(423℃F) - Qhov taw qhia eutectic txhim khu kev qha rau kev rov ua haujlwm zoo ib yam.
Standard Diameters: Muaj los ntawm 0.20mm (0.012 ") txog 0.76mm, catering kom nplua -pitch BGA thiab CSP pob. (Size Customizable)
Surface Finish: High sphericity (>95%) thiab kev huv si zoo heev txo cov voids thiab xyuas kom muaj kev sib koom ua ke sib koom ua ke.
Kev faib tawm yam khoom
Tin Solder Balls
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SAC405 Solder Balls: The Premium Lead-Tshuaj Dawb rau High-Reliability Electronics

 

Kev tsim kho kom zoo tshaj plaws hauv cov khoom siv hluav taws xob uas xav tau tshaj plaws, SAC405 solder balls xa cov kev sib koom ua ke tsis sib xws thiab kev ua haujlwm thermal. Raws li cov hlau lead -dawb alloy muaj li ntawm 95.5% Tin, 4% Silver, thiab 0.5% Copper, lawv ua tau raws li cov txheej txheem thoob ntiaj teb nruj me ntsis thaum muab cov khoom siv zoo tshaj plaws rau BGA, CSP, thiab flip-chip daim ntawv thov.

Kev ntseeg siab los ntawm cov tuam txhab ua lag luam semiconductor rau kev sib txuas tseem ceeb hauv AI chips, automotive electronics, thiab siab -kev ua tau zoo.

 

Kev sib xyaw & Cov ntsiab lus tseem ceeb

 

SAC405 (Sn95.5Ag4.0Cu0.5) yog eutectic, lead- dawb solder alloy. Nws cov formulation yog optimized rau qhov sib npaug ntawm lub zog, thermal conductivity, thiab manufacturability.

Alloy Composition

Tin (Sn): 95.5% - Muab lub hauv paus matrix thiab txiav txim siab melting point.
Nyiaj (Ag): 4.0% - Txhim kho txhua yam muaj zog, qaug zog, thiab thermal conductivity.
Copper (Cu): 0.5% - Txhim kho tus cwj pwm wetting thiab txo qhov sib txuas ntawm intermetallic (IMC) brittleness.

Lub cev & Thermal Properties

Melting Point: ~ 217℃(423℃F) - Qhov taw qhia eutectic txhim khu kev qha rau kev rov ua haujlwm zoo ib yam.
Standard Diameters: Muaj los ntawm 0.20mm (0.012 ") txog 0.76mm, catering kom nplua -pitch BGA thiab CSP pob. (Size Customizable)
Surface Finish: High sphericity (>95%) thiab kev huv si zoo heev txo cov voids thiab xyuas kom muaj kev sib koom ua ke sib koom ua ke.

Performance Advantages & Applications

 

SAC405 solder balls yog qhov mus- xaiv rau cov ntawv thov uas tsis ua haujlwm tsis yog qhov kev xaiv. Cov ntsiab lus siab nyiaj ncaj qha txhais mus rau kev txhim kho kev ua haujlwm hauv kev ntxhov siab.

Vim li cas thiaj xaiv SAC405?
 
 

Superior Mechanical Strength

Muab kwv yees li 15% siab dua pob shear zog piv rau qis dua -nyiaj alloys xws li SAC305, muab kev sib txuas ruaj khov tiv taus kev poob siab thiab kev co.

 
 
 

Zoo heev Thermal Fatigue Resistance

Withstands huab cua kub caij tsheb kauj vab (-40℃rau 125 degree), ua rau nws zoo tagnrho rau tsheb, neeg rau zaub mov, thiab sab nraum zoov hluav taws xob uas muaj kev thermal expansion thiab contraction.

 
 
 

Txhim khu kev ntseeg siab

Cov kev tshawb fawb pom tias SAC405 muab qhov ntsuas kub zoo-txoj kev ntseeg tau ntawm cov khoom siv rau pob Grid Array (BGA) uas tau dhau los ntawm isothermal aging thiab kub cycling, ua rau muaj kev ua haujlwm tsawg dua.

 
Cov ntawv thov tseem ceeb

Siab -Kev Ua Haujlwm Kev Ua Haujlwm & AI Chips

Siv hauv GPU thiab CPU BGA ntim rau cov servers thiab cov chaw khaws ntaub ntawv.

Automotive Electronics

Tseem ceeb heev rau lub cav tswj units (ECUs), ADAS sensors, thiab infotainment systems uas qhov kub thiab txias heev.

Advanced Ntim

Qhov tseem ceeb rau Chip-Scale Packages (CSP), ntxeev-chip interconnects, thiab 3D IC stacking.

Kev kho mob & Aerospace

Xaiv rau lub hom phiaj- cov khoom siv tseem ceeb uas xav tau qib siab tshaj plaws ntawm kev sib koom ua ke ntawm kev ncaj ncees.

 

 

Cim npe nrov: Tuam Tshoj high ag sac manufacturers, lwm tus neeg, Hoobkas

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