SAC305 Copper Core Balls: Lub Siab -Kev Ua Tau Zoo, Lead{2}} Kev daws dawb
SAC305 Copper Core Balls yog tsim los ua kom muaj kev ua tau zoo tshaj plaws hauv cov hlau lead -cov khoom siv hluav taws xob dawb. Qhov kev sib txuas siab heev no ua ke nrog lub siab - purity tooj liab core nrog ib txheej txheej ntawm kev lag luam - qauv SAC305 alloy (Sn96.5Ag3.0Cu0.5). Qhov tshwm sim yog lub pob solder uas muaj qhov zoo tshaj plaws thermal thiab hluav taws xob conductivity ntawm tooj liab, ua ke nrog kev txhim khu kev qha, RoHS{10}}raws li solderability ntawm SAC305. Qhov zoo tshaj plaws rau kev thov cov ntawv thov uas sib koom ua ke, thermal qaug zog tiv thaiv, thiab kev rov ua kom zoo ib yam yog qhov tseem ceeb.
Core Advantages & Technical Specifications
Cov tub ntxhais tooj liab muab qhov tsis yog- melting structural kev txhawb nqa thaum lub sij hawm reflow, pab tswj standoff qhov siab thiab tiv thaiv tej yam tsis xws luag xws li lub taub hau- nyob rau hauv- hauv ncoo (HiP) nyob rau hauv nplua -pitch Ball Grid Array (BGA) thiab Chip Scale Package (CSP) daim ntaub ntawv. Qhov no yog qhov tseem ceeb rau kev tswj hwm coplanarity hauv cov pob loj, ntom ntom. Lub SAC305 txheej txheej ua kom zoo wettability thiab tsim cov ntaub ntawv muaj zog intermetallic nrog cov substrate tiav zoo li ENIG (Electroless Nickel Immersion Gold) thiab OSP (Organic Solderability Preservative).
Lub ntsiab feature ntawm peb cov khoom yog nws customizable SAC305 plating thickness thiab alloy muaj pes tsawg leeg. Thaum peb muab cov txheej txheem SAC305 plating, peb kuj tuaj yeem kho qhov sib txawv ntawm cov hlau alloy, suav nrog cov ntsiab lus kub (Au) hauv cov txheej txheem tshwj xeeb yog tias xav tau, kom ua tau raws li cov txheej txheem tshwj xeeb, kev xav tau kev sib raug zoo, lossis kev txhawb nqa kev ntseeg siab.
Performance & Application Fit
SAC305 Copper Core Balls ua tau zoo hauv cov ntawv thov uas xav tau kev ntseeg siab nyob rau hauv thermal thiab mechanical stress. Kev sib xyaw ua ke muab kev poob siab zoo dua thiab kev ua haujlwm thermal cycling piv rau cov qauv homogeneous SAC305 khoom. Lawv yog cov kev xaiv zoo tshaj plaws rau cov khoom siv hluav taws xob hauv tsheb, kev sib txuas lus kho vajtse, thiab siab -cov khoom siv suav nrog qhov ntev - lub sij hawm ua haujlwm tsis yog - sib tham tau.
Muaj nyob rau hauv ib txoj kab uas hla ntawm 0.1mm mus rau 0.76mm nrog nruj kheej kheej tolerances, lawv xyuas kom meej luam ntawv, tso, thiab reflow tus cwj pwm. Cov khoom no tau ua tiav nrog cov qauv txhuas -dawb solder pastes thiab reflow profiles.
Ntsiab Specifications ntawm ib Glance
|
Feature |
Specification / Cov txiaj ntsig |
|
Cov khoom siv tseem ceeb |
Siab -Purity Oxygen- Dawb Copper (Cu Ntau dua lossis sib npaug li 99.9%) |
|
Plating Khoom |
Txheem SAC305 (Sn96.5Ag3.0Cu0.5) |
|
Plating Thickness / Txheej |
Customizable (nrog rau cov ntsiab lus Au tshwj xeeb yog xav tau) |
|
Txoj kab uas hla |
0.10mm - 0.76mm (Qhov ntau thiab tsawg muaj) |
|
Qhov tseem ceeb Advantage |
Txhim kho lub zog siv tshuab, HiP tiv thaiv, Lead - Dawb |
|
Zoo tagnrho Rau |
Automotive, Networking, Server, Siab -Reliability BGA/CSP |
Vim li cas thiaj xaiv Peb SAC305 Copper Core Balls?
Nyob rau hauv lub laub rau miniaturization thiab kev ntseeg siab dua, SAC305 Copper Core Balls muab cov kev daws teeb meem ntse uas hais txog cov kev txwv ntawm cov txheej txheem solder spheres. Lawv muab txoj hauv kev txhim kho ncaj qha rau cov qauv tsim tawm tsam nrog thermal qaug zog lossis teeb meem kev sib koom tes yam tsis tau txav deb ntawm qhov paub, txhim khu kev qha SAC305 chemistry.
Peb cov txheej txheem tsim khoom tau lees tias qhov tshwj xeeb sphericity, qis oxidation, thiab batch -rau -batch sib xws. Peb muab tag nrho cov ntaub ntawv traceability thiab ua raws li RoHS, REACH, thiab lwm yam txheej txheem thoob ntiaj teb.
Cim npe nrov: sac305 cub, Tuam Tshoj sac305 cub manufacturers, lwm tus neeg, Hoobkas
